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STRUCTURE PRODUCT SERIES TYPE FUNCTION
Silicon monolithic integrated circuits Bipolar stepping motor driver
BD63860EFV
PWM constant current controllable two H bridge driver Built-in translator circuit for CLK-IN control Full, Half, Quarter, and Eighth step modes Mixed decay control
Absolute maximum ratings(Ta=25) Item Supply voltage
Limit Unit -0.2+36.0 V 1 W 1.45 Power dissipation Pd 4.702 W Input voltage for control pin VIN -0.2+7.0 V RNF maximum voltage VRNF 1.0 V Maximum output current IOUT 2.53 A/phase Operating temperature range Topr -25+85 Storage temperature range Tstg -55+150 Junction temperature Tjmax +150 1 70mmx70mmx1.6mm glass epoxy board. Derating in done at 11.6mW/ for operating above Ta=25. 2 4-layer recommended board. Derating in done at 37.6mW/ for operating above Ta=25. 3 Do not, however exceed Pd, ASO and Tjmax=150.
Symbol VCC1,2
Recommended operating conditions (Ta=-25+85) Item Symbol Min. Supply voltage VCC1,2 16 Output current IOUT 4 Do not, however exceed Pd, ASO. This product isn't designed for protection against radioactive rays.
Typ. 24 1.5
Max. 28 1.74
Unit V A/phase
Status of this document The Japanese version of this document is the formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document, formal version takes priority.
Rev. A
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Electrical characteristics (Unless otherwise specified Ta=25, VCC1,2=24V) Item Symbol Min. Limit Typ. Max. Unit Conditions
Whole Circuit current at standby ICCST 0.4 2.0 Circuit current ICC 4.0 7.0 Control input (PS, RESET, ENABLE, CLK, CW/CCW, MODE1, MODE2, SR) H level input voltage VINH 2.0 5.5 L level input voltage VINL 0 0.8 H level input current IINH 38 55 94 L level input current IINL -10 0 Output (OUT1A, OUT1B, OUT2A, OUT2B) Output ON resistance Output leak current Current control RNFX input current VREF input current VREF input voltage range VCR input current VCR input voltage range MTH input current MTH input voltage range Comparator threshold 1 Comparator threshold 2 Comparator threshold 3 Minimum on time RON ILEAK IRNF IVREF VREF IVCR VVCR IMTH VMTH VCTH1 VCTH2 VCTH3 tONMIN -40 -2.0 0 60 3.0 -2.0 0 0.212 0.142 0.076 0.21 0.8 -20 -0.1 100 -0.1 0.250 0.177 0.096 0.54 1.0 10 3.2 140 5.5 3.5 0.288 0.212 0.116 0.92
mA mA V V A A
PS=L PS=H, VREF=2V
VIN=5.5V VIN=0V IOUT=1.5A, Sum of upper and lower
A A A V A V A V V V V s
RNFX=0V VREF=0V VCR=3.3V MTH=0V VREF=2V, 100% VREF=2V, 70.71% VREF=2V, 38.27% R=39k,C=1000pF
Rev. A
3/4 Package outline Product No.
BD63860EFV
Lot No.
HTSSOP-B28 (Unit:mm) Block diagram Pin No. / Pin name Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Pin name RNF1 NC CW/CCW OUT1A MTH CR1 GND VREF CR2 VCR OUT2A MODE2 MODE1 RNF2 Pin No. 15 16 17 18 19 20 21 22 23 24 25 26 27 28 Pin name VCC2 SR RESET OUT2B CLK TEST GND NC NC NC OUT1B ENABLE PS VCC1
Buffer VREF 8 DAC
Current Limit Comp.
28 VCC1 4 OUT1A
CR1 6
CR Timer
Logic
Predriver
25 OUT1B 1 RNF1
MTH 5 CLK 19 MODE2 12 MODE1 13 CW/CCW 3 ENABLE 26 Translator TSD RESET VCR 10 DAC
OCP
16 SR
Reg OVLO UVLO
27 PS 17 RESET
Current Limit Comp.
15 VCC2 11 OUT2A
CR2 9
CR Timer
Logic
Predriver
18 OUT2B 14 RNF2
NC : Non Connection
OCP
21 GND
TEST 20
7 GND
Rev. A
4/4 Operation Notes (1) Absolute maximum ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. (2) Power supply lines As return of current regenerated by back EMF of motor happens, take steps such as putting capacitor between power supply and GND as an electric pathway for the regenerated current. Be sure that there is no problem with each property such as emptied capacity at lower temperature regarding electrolytic capacitor to decide capacity value. If the connected power supply does not have sufficient current absorption capacity, regenerative current will cause the voltage on the power supply line to rise, which combined with the product and its peripheral circuitry may exceed the absolute maximum ratings. It is recommended to implement a physical safety measure such as the insertion of a voltage clamp diode between the power supply and GND pins. (3) GND potential The potential of GND pin must be minimum potential in all operating conditions. (4) Metal on the backside (Define the side where product markings are printed as front) The metal on the backside is shorted with the backside of IC chip therefore it should be connected to GND. Be aware that there is a possibility of malfunction or destruction if it is shorted with any potential other than GND. (5) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. This IC exposes its frame of the backside of package. Note that this part is assumed to use after providing heat dissipation treatment to improve heat dissipation efficiency . Try to occupy as wide as possible with heat dissipation pattern not only on the board surface but also the backside. (6) Actions in strong electromagnetic field Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction. (7) ASO When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO. (8) Thermal shutdown circuit The IC has a built-in thermal shutdown circuit (TSD circuit). If the chip temperature becomes Tjmax=150, and higher, coil output to the motor will be open. The TSD circuit is designed only to shut the IC off to prevent runaway thermal operation. It is not designed to protect or indemnify peripheral equipment. Do not use the TSD function to protect peripheral equipment. (9) Ground Wiring Pattern When using both large current and small signal GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external components, either. (10) Mounting errors and Inter-pin short When attaching to a printed circuit board, pay attention to the direction of the IC and displacement. Improper attachment may lead to destruction of the IC. There is also possibility of destruction from short circuits which can be caused by foreign matter entering between outputs or an output and the power supply or GND. (11) TEST pin Be sure to connect TEST pin to GND.
Rev. A
Appendix
Notes
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Appendix1-Rev3.0

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